General PCB board materials can be divided into two categories: rigid substrate materials and flexible substrate materials. The general rigid substrate material is copper-clad laminate, which is made of reinforcing material (Reinforeing Material), soaked in resin adhesive, dried, cut, and laminated into a blank, and then covered with copper foil, using a steel plate as a mold, and pressing it in a hot press It is made by high temperature and high pressure forming processing. The prepreg used in general multi-layer boards is a semi-finished product in the manufacturing process of copper-clad laminates (mostly made of glass cloth impregnated with resin and dried).

There are many ways to classify copper clad laminates. According to the different reinforcing materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), laminated multi-layer board base and special material base (ceramic, metal core base, etc.). If classified according to the resin adhesive used in the board, common paper-based CCI includes phenolic resin (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resin (FE-3), polyester resin, etc. Various types. Common fiberglass cloth-based CCLs include epoxy resin (FR-4, FR-5), which is currently the most widely used fiberglass cloth-based type. There are also other special resins (using glass fiber cloth, polyamide fiber, non-woven fabric, etc. as additional materials): bismaleimide-modified triazine resin (BT), polyimide resin (PI) , diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, etc.